This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys: ? tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; ? tin-antimony; ? tin-bismuth; ? tin-copper, with and without silver; ? tin-indium, with and without silver and bismuth; ? tin-silver, with and without copper and bismuth; ? tin-zinc, with and without bismuth. It also includes an indication of the forms generally available.