Standard IEC standard · IEC 61191-3:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Status: Withdrawn

· Replaced by: IEC 61191-3:2017

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Standard IEC standard · IEC 61191-3:1998

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Scope

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Subjects

Mechanical structures for electronic equipment (31.240)

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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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